Thermal Solutions Pavilion

Heat Decides Performance

Thermal materials, coatings, cooling and testing for high-heat electronics

Purpose 1
Heat now sets the limit of performance

  • AI chips, data centers, batteries, power electronics: one bottleneck, heat
  • Heat causes field failures: delamination, cracks, warpage, shorter life
  • Thermal materials are import-dependent; suppliers need buyer contacts

Purpose 2
Thermal items from four shows, new demand-side buyers

  • Thermal coatings, treatments, materials and testing gathered in one pavilion
  • New buyers from AI chips, data centers, batteries, mobility and defense
  • QC and process engineers handling heat defects as the primary buyer group

Key Items

Thermal Materials

TIM (thermal interface materials), thermal fillers and pads, insulation and heat-shielding materials, PCM and heat storage

Thermal Coatings

Heat-dissipation and heat-shielding coatings, thermal surface treatments, insulating and low-k materials

Cooling Systems

Heat sinks, vapor chambers, CDUs, liquid cooling and other cooling components and systems

Thermal Testing

Thermal conductivity, resistance and thermophysical measurement; thermal shock and cycling tests; thermal imaging

Thermal Design SW

Thermal flow simulation, thermal analysis and design tools, thermal data analytics